Samsung’s New Chipsets Bring Better Battery Life to Wireless Earbuds

Samsung has announced a few of power management integrated circuits (PMIC) for True Wireless Stereo (TWS) devices. Being described by the corporate because of the industry’s first all-in-one PMICs, the MUA01 and MUB01, are said to integrate multiple discrete components in one chip for enhanced power efficiency and more efficient designs in today’s True Wireless Stereo earbuds.

While the MUA01 is supposed for the charging case, the MUB01 has been designed for the earphone itself. The chips are said to return with up to 10 discrete components that combine several of the company’s in-house logic technologies into one integrated chipset. a number of the critical components within the PMIC include switching chargers and discharge circuits.

According to Samsung, the new technology enables the PMICs to occupy but half the space of their predecessors. “The compact solutions can allot more room to the battery for extended playback time and enable more flexible and efficient designs”, said the corporate. Both the chips are currently in production and may be found within the company’s recently-announced Galaxy Buds+ TWS earbuds.

Samsung further claimed that the MUA01 is additionally the industry’s first solution to support both wireless and wired charging during a single chip. For wireless charging, it supports the Wireless Power Consortium’s latest power transfer interface standard, Qi 1.2.4. additionally, it also comes with a microcontroller unit (MCU) and embedded Flash (eFlash), offering the choice of modifying its firmware to support other applications.

In a politician handout, Dong-ho Shin, senior vice chairman of System LSI marketing at Samsung Electronics, said:

“TWS earbuds present elevated listening experiences for more users and the trend is rapidly expanding the mobile accessory market, creating new opportunities for device manufacturers. Samsung’s industry-first, all-in-one power management solutions optimized for TWS devices will allow manufacturers to craft new applications with greater flexibility”.

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